- 교과목 개요: 반도체 소자의 후공정과 전자패키징의 목적, 방법, 성능/신뢰성 평가에 대해 기본원리를 이해하고, 이들 공정에 요구되는 다양한 소재의 특징에 대해 학습하며, 기존 반도체 패키징 기술과 함께 향후 반도체 집적에 요구되는 이종집적 기술개발에 활용될 수 있도록 함
- 교육 목표: This class covers basic theories and processes for BEOL(back end of line) and electronic packaging, including their measurements and inspection in the view of mechanical, electrical and thermal managements. When taking this class, students are expected to develop their abilities of understanding the legacy semiconductor packaging and the future heterogeneous integration technologies

해당없음(반도체소재개론, 소재구조론 선수 권장)

- Attendance(10%), midterm exam (30%), final exam (30%), term project presentation (or report submission) (review problems in advanced electronic packaging technology(or BEOL) and suggest new solutions to the issues) (30%)

1. Fundamentals of Microsystems packaging, R.R. Tummala, McGraw-Hill 2001, 2. Materials for advanced packaging, D. Lu, C.P. Wong, Springer, 1995, 3. Wafer level 3-D ICs process technology, C.S. Tan, R.J. Gutmann, L. Rafael Reif, Springer 2008

1st week Introduction/ BEOL & electronic packaging
2nd week Process and materials of BEOL (depo, patterning, etching, etc)
3rd week Electronic packaging technology (through hole, surface mount, FC, etc)
4th~5th week Basic theories and characterization in electronic packaging (mech., elect., thermal)
6th~7th week Materials in electronic packaging (metals, underfill, ACF, TIM, etc)
8th week Midterm exam
9th~11th week Interconnect in electronic packaging (bonding, soldering, TSV, etc)
12th week Nanotechnology in BEOL & electronic packaging
13th week Measurements & inspection in electronic packaging
14th~15th week 3D integration & Heterogeneous Integration
Presentation of term project
16th week Final Exam

강의교재, 참고문헌, 최근 논문을 활용한 PPT 강의, term-project 발표

강의교재, 참고문헌 등을 활용한 이론 강의(PPT), term-project 발표/토론