3. 강의목표
Overview:
Semiconductor devices consist of stacked thin-film layers that collectively determine their functionality and performance. These semiconductor thin films are formed on substrates and exhibit distinct physical and chemical properties from bulk materials due to their large surface-to-volume ratio and interfacial effects. This course aims to provide a fundamental understanding of the growth mechanisms, surface phenomena, and electrical, mechanical, and thermal properties of semiconductor thin films. Students will also learn the principles behind experimental techniques used to measure and analyze these properties. Based on this understanding, the course will help students develop the ability to apply thin-film science to semiconductor device development.
Educational Goals:
Through understanding semiconductor thin-film processes, scaling effects, and various physical properties (electrical, mechanical, and thermal) of materials used in semiconductor devices and packaging, students will cultivate the ability to apply these principles to a broad range of semiconductor device and advanced packaging applications. And students will have practical abilities of understanding and evaluation of semiconductor reliability (electrical, mechanical, and thermal) in industry.
4. 강의선수/수강필수사항
At least one of the following courses is required. Introduction to materials science
5. 성적평가
| 중간고사 |
기말고사 |
출석 |
과제 |
프로젝트 |
발표/토론 |
실험/실습 |
퀴즈 |
기타 |
계 |
| 30 |
40 |
10 |
|
|
|
|
20 |
|
100 |
| 비고 |
Midterm exam (30%), Final exam(40%), Pop quiz (20%), Attendance (10%)
|
6. 강의교재
| 도서명 |
저자명 |
출판사 |
출판년도 |
ISBN |
|
Lecture materials will be provided during class
|
|
|
0000
|
|
7. 참고문헌 및 자료
Reference materials will be provided during lectures.
8. 강의진도계획
Week 1~2. Thin film growth and related feature
Week 3~6. surfaces, diffusion, reactions in thin films
Week 7. Thin film mechanics in semiconductor devices
Week 8. Midterm exam
Week 9~11. Thin film mechanics in multilayer-structured semiconductor devices II
Week 11~14. Electrical and thermal properties of materials in semiconductor devices and packages
Week 14 ~15. Understanding and evaluation of failures and reliabilities in thin films of semiconductor devices and packages
Week 16. Final exam
10. 학습법 소개 및 기타사항
- Theoretical lectures will be conducted using PPT slides based on lecture materials and references.
- Q&A sessions will be provided to enhance understanding of the course content.
11. 장애학생에 대한 학습지원 사항
- 수강 관련: 문자 통역(청각), 교과목 보조(발달), 노트필기(전 유형) 등
- 시험 관련: 시험시간 연장(필요시 전 유형), 시험지 확대 복사(시각) 등
- 기타 추가 요청사항 발생 시 장애학생지원센터(279-2434)로 요청